Partnership of Samsung Electronics and Mitsubishi

Samsung Electronics decided to develop a core solution chip of camera for mobile equipments jointly with Mitsubishi through partnership.

Samsung Electronics said on September 26, “To develop the core solution required for the camera products for mobile equipment, we made the partnership with Mitsubishi. We will complete the development of compatible technology with products of each company by the end of the year.”

In the partnership agreement, two companies will jointly develop CIS chip, ISP chip and combined CIS+ISP chip which is the core chip of camera for mobile equipments such as mobile phone, PDA and mobile PC through providing CMOS image sensor (CIS) technique by Samsung Electronics and ISP technique by Mitsubishi.

CIS is a non-memory semiconductor which changes to an electric signal receiving a light through lens. ISP is the semiconductor which converts the image signal received through CIS into the digital video signal.

Two companies expect to extend the 3rd generation mobile phone market in US and Europe through supplying the high performance products and leading the camera chip market for mobile equipment through the partnership.

Yeon-Su Shin ysshin@donga.com