Samsung Electronics said on Wednesday that it has begun mass production of 512-gigabyte (GB) embedded Universal Flash Storage (eUFS) 3.0 (picture), its next generation mobile memory chip.
The solution is twice as fast as the existing eUFS 2.1, boasting sequential read speed of 2,100MBps. Users will be able to transfer a full HD movie (3.7GB) to a computer in three seconds. Along with the mass production of 512GB and 128GB models this month, the tech giant is planning to produce 1TB and 256GB versions in the latter half of this year.
“With the mass production of eUFS 3.0, consumers will have the same level of satisfaction and convenience they experienced with laptops with high-end specifications on mobile devices as well,” said Choi Cheol, executive vice president of Memory Sales & Marketing at Samsung Electronics. “We will help global manufactures in the premium mobile market make a new leap forward by expanding our lineup, including 1TB, within this year.”
Dong-Jun Heo firstname.lastname@example.org